Institude of Integrated Mircosystems Funded Project

Project Title:

Surface-Mounted Polymer-based Ultra-Fast Response Fuse Devices

Principal Investigator:

Prof Chi-Ming CHAN, Department of Chemical Engineering, HKUST

Project Duration:

Jul 1, 2002 to Jun 30, 2004

Project Summary:

One of the recent important developments in circuit-protection technology is the use of conductive polymer composite materials in transient-voltage-surge-suppression (TVSS) devices to protect sensitive equipment and integrated circuits, against over-voltage threats. This project is to develop new voltage-sensitive materials and new process technologies to manufacture TVSS devices. A solvent-free polymerization procedure using platinum complex as catalysis to produce voltage-sensitive materials has been developed. A complete fabrication methodology has also been developed for preparing the surface-mounted TVSS device. The working devices were tested several key electrical characteristics such as trigger voltage (184-288 V), leakage current (<10pA at 6 V), resistance (>400 GW at 6 V) and capacitance (<21pF at 1 Mz).

Research Output:

  1. Publication
    2.

    • C.-M. Chan, K.M. Ng and C. YC Wong, US Patent Pending 2004: Overvoltage protection materials and process for preparing same

    • K.M. Ng, K. Cheung and C.-M. Chan, "Structural Analysis of Polymer Composite Materials for Overvoltage Protection Application - Prepared by a "Clean" Solvent-Free Polymerisation Process," Technical Report in 2004.

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